Author:
Smy T.,Vick D.,Brett M. J.,Dew S. K.,Wu A. T.,Sit J.C.,Harris K. D.
Abstract
AbstractA new fully three dimensional (3D) ballistic deposition simulator 3D-FILMS has been developed for the modeling of thin film deposition and structure. The simulator may be implemented using the memory resources available to workstations. In order to illustrate the capabilities of 3D-FILMS, we apply it to the growth of engineered porous thin films produced by the technique of GLancing Angle Deposition (GLAD).
Publisher
Springer Science and Business Media LLC