Adhesive Failure of a Thin Epoxy Film on an Aluminized Substrate

Abstract

ABSTRACTIn this study we used nanoindentation to determine mechanical properties and combined nanoindentation with stressed overlayers to determine interfacial fracture energy of a 164 nm thick film of Epon 828/T403 on an aluminized glass substrate. The combination of nanoindentation and a tungsten overlayer was required to trigger delamination of the epoxy film from the aluminized substrate. Mechanics-based models for circular blister formation were then used to determine residual stresses and interfacial fracture energies. This approach showed that the tungsten overlayer had a compressive residual stress of 1.9 GPa which drove blister formation at a fracture energy of 1.9 J/m2 with a phase angle of loading equal to –62°.