Capillary Self-Assembly for 3D Heterogeneous System Integration and Packaging-Reference-Cited by-同舟云学术

Capillary Self-Assembly for 3D Heterogeneous System Integration and Packaging

Published:2016-07 Issue:34 Volume:1 Page:2355-2366
ISSN:2059-8521
Container-title:MRS Advances
language:en
Short-container-title:MRS Advances

Author:

Ito Yuka,Fukushima Takafumi,Lee Kang-Wook,Tanaka Tetsu,Koyanagi Mitsumasa

Publisher

Springer Science and Business Media LLC

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Link

http://link.springer.com/content/pdf/10.1557/adv.2016.528.pdf

Reference16 articles.

1. T. Fukushima, Y. Yamada, H. Kikuchi and M. Koyanagi, “New Three-Dimensional Integration Technology Using Self-Assembly Technique”, IEDM Tech. Dig., (2005), p.359.

2. T. Fukushima, E. Iwata, Y. Ohara, M. Murugesan, J.-C. Bea, K.-W. Lee, T. Tanaka and M. Koyanagi, IEEE Trans. Compon., Packag., Manuf. Technol. 1, 12, 1873 (2011).

3. K.-W. Lee, S. Kanno, K. Kiyoyama, T. Fukushima, T. Tanaka and M. Koyanagi, J. Microelectromech. Syst. 19, 6, 284 (2010).

4. T. Fukushima, E. Iwata, T. Konno, J.-C. Bea, K.-W. Lee, T. Tanaka and M. Koyanagi, Appl. Phys. Lett., 96, 15, 154105 (2010).

5. T. Fukushima, E. Iwata, Y. Ohara, M. Murugesan, J. Bea, K. Lee, T. Tanaka and M. Koyanagi, , IEEE Trans. Electron Devices, 59, 2956 (2012).

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