Ion Implantation of Iron into an Immiscible Copper Matrix

Abstract

AbstractFluences from 1×1017 to 9.6×1017 cm−2 of single and doubly charged iron ions accelerated through 170 kV were implanted into polycrystalline copper substrates at room temperature. An order of magnitude decrease in reflectivity was observed during implantation as a result of sputter-induced changes in surface topography and subsurface accumulation of iron. Both scanning electron microscopy and optical microscopy showed that the bombarded surfaces consisted of (110) and (100) grains having an intragranular, ridge-like structure. Significant height differences formed between grains as a result of their different sputtering yields. Transmission electron microscopy reveals that the implanted iron forms a face-centered-cubic metastable solid solution with the copper. Auger electron spectroscopy confirmed iron accumulation beneath the surface with maximum concentrations approaching in excess of 20 atomic percent.