Author:
León-Patiño Carlos A.,Ramirez-Vinasco Deisy,Aguilar-Reyes Ena A.,Nanko Makoto
Publisher
Springer Science and Business Media LLC
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference23 articles.
1. K. Kuang, F. Kim and S.S. Cahill, “High Thermal Dissipation Ceramics and Composite Materials for Microelectronic Packaging,” RF Microwave Microelectronic Packaging, (Springer, 2010). pp 207–232.
2. M. Chmielewski and W. Weglewski, Bull. Polish Acad. Sci. Tech. Sci. 61, 507–514 (2013).
3. C. A. Leon, G. Rodriguez-Ortiz, M. Nanko, and E. A. Aguilar, Powder Technol. 252, 1–7 (2014).
4. A. Canakci and T. Varol, Powder Technol. 268, 72–79 (2014).
5. U. Anselmi-tamburini, S. Gennari, J. E. Garay and Z. A. Munir, Mater. Sci. Eng. A. 394, 139–148 (2005).
Cited by
2 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献