Toughened, Inorganic-Organic Hybrid Materials for Microelectronic Application

Author:

Hedrick J. L.,Srinivasan S.,Cha H.-J.,Yoon D.,Flores V.,Harbison M.,Pietro R. Di,Hinsberg W.,Deline V.,Brown H. R.,Sherwood M.,Paulson E.,Miller R. D.,Cook R.,Liniger E.,Simonyi E.,Klaus D.,Cohen S.,Hummel J.

Abstract

AbstractTransparent, nanophase-separated, inorganic-organic hybrid polymers with dielectric constants below 3.0 have been prepared from reactively functionalized poly(amic ester) derivatives and substituted, oligomeric silsesquioxanes. These hybrid materials are stable to 400 °C and above and form tough, crack-free films. Induced cracking and crack propagation studies performed with the application of external stress suggest a maximum critical film thickness of at least 2.0 μm under severe stress conditions. These hybrid materials appear to be significantly toughened by the chemical incorporation of the polyimides relative to organically modified silicates and spin-on-glasses without significantly effecting other important polymer properties of the silicates.

Publisher

Springer Science and Business Media LLC

Subject

General Engineering

Reference17 articles.

1. 12. A preliminary description of the preparation of nanoscopic hybrids from silsesquioxanes and reactively terminated polyamic esters has been submitted for publication: Hedrick J. L. , Cha H.-J. , Srinivasan S. et al., Macromolecules (1997).

2. Drying gels

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