Point defects in thin HfAlOx films probed by monoenergetic positron beams

Abstract

ABSTRACTThin HfAlOx films grown on SiON(0.9 nm)/Si by atomic layer deposition technique were characterized by using monoenergetic positron beams. The lifetimes of positrons in the HfAlOx film after post-deposition annealing (PDA) ranged between 412–403 ps. Since these lifetimes were longer than the lifetime of positrons trapped by point defects in metal oxides, such as LaCoO3, PbTiO3, and BaTiO3, the positrons in HfAlOx films were considered to annihilate from the trapped state by open spaces which exist intrinsically in their amorphous structure. The line-shape parameter S of the Doppler broadening spectrum corresponding to the annihilation of positrons in HfAlOx films decreased by PDA, and the S value decreased with increasing an O2-content in an atmosphere during PDA (0.004–1%). The observed behavior of the S value was attributed to the shrinkage of the open spaces due to the change in the matrix structure of HfAlOx. After P+- and B+-implantation into poly-Si films grown on the HfAlOx films, the diffusion of positrons in the Si substrates toward the HfAlOx film was suppressed. This fact was attributed to positive charges introduced near the HfAlOx films.