1. 16. Schietinger C. , Adams B. and Yarling C. , “Riplle technique: a novel non-contact wafer emissivity and temperature method for RTP”, (this volume)
2. Emissivity Issues In Pyrometric Temperature Monitoring For RTP Systems
3. Temperature Non-Uniformities During Rapid Thermal Processing Of Patterned Wafers
4. 5. Kermani A. , Ku Y. H. , Wong F. , Kim K. B. , Maillot P. , Morgan A. E. , Hahn S. , “The application of rapid thermal vapor deposition of doped-thin single crystal silicon for MOS and bipolar technologies”, SPIE Proc. 11-a (1989) p. 121.
5. 14. Vandenabeele P. and Maex K. , to be published.