Author:
Kim Hyeon-Seag,Polla D. L.,Campbell S. A.
Abstract
AbstractThe electrical reliability properties of PZT (54/46) thin films have been measured for the purpose of integrating this material with silicon-based microelectromechanical systems. Ferroelectric thin films of PZT were prepared by metal organic decomposition. The charge trapping and degradation properties of these thin films were studied through device characteristics such as hysteresis loop, leakage current, fatigue, dielectric constant, capacitancevoltage, and loss factor measurements. Several unique experimental results have been found. Different degradation processes were verified through fatigue (bipolar stress), low and high charge injection (unipolar stress), and high field stressing (unipolar stress).
Publisher
Springer Science and Business Media LLC
Reference7 articles.
1. 1. Tamagawa T. , Polla D. L. , and Hseuch C.-C. , IEEE International Electron Device Meeting, San Francisco, Dec. pp. 617 (1990)
2. Electrical characteristics of ferroelectric PZT thin films for DRAM applications
3. Electronic Conduction Characteristics of Sol-Gel Ferroelectric $\bf Pb(Zr_{0.4}Ti_{0.6})O_{3}$ Thin-Film Capacitors: Part I
4. Electrochemical models of failure in oxide perovskites
5. Crystallization behavior in a low temperature acetate process for perovskite PbTiO3, Pb(Zr, Ti)O3, and (Pb1−x, Lax) (Zry, Ti1−y)1−x/4O3 bulk powders
Cited by
1 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献