Evolution of the Electrical Properties of Interconnects Under Electromigration Stress

Abstract

AbstractWe report experimental results of measurements of the changes in the resistance and thermal non-linearity of a variety of samples during accelerated electromigration stress to failure. The value of the extra measurement of the second harmonic of the AC bridge signal is illustrated by observations of changes in the thermal conductance to the substrate and the temperature coefficient of resistivity which are not detected by the resistance measurement. These quantities are also larger than the resistance measurement.