Profile Simulation of Reactive Ion Etching for Silicon Tip-on-Post and Bottle-Neck Structures in Fed Applications

Abstract

ABSTRACTThis articles describes an investigation of the reactive ion etching of tip-on-post and bottle-neck silicon structures used for fabrication field emission devices. The analytical study for the angular distribution of incident etching ions is presented by the simulation with temporal profile evolution. The surface simulations are compared with experimental results. This comparison shows that numerical expression for the angular distribution could be applied for incident ion flux in case tip-on-post and bottle-neck silicon structures.