Removal of Different Thicknesses Influences the Repair Bond Strength of Dental Resin Composites

Author:

Yu Kai,Wan Minting,Shi Kui,Xue Longjian,Chen Zhi,Zhang Lu

Abstract

This study investigates the repair bond strength of aged resin composites after removing different thicknesses, determine the repair performance using the same or different resin composites and describe the treated surfaces after ageing. Seventy simulated class I cavities were prepared in extracted human third molars were randomly divided into two groups and restored with a nanofilled (Filtek Z350) or a microhybrid (Clearfil APX) composite. Five specimens without ageing in each group acted as a positive control for microtensile bond strength (MTBS) test. After thermocycling, each group was randomly divided into two subgroups: Group RT1, 1 mm removed and Group RT3, 3 mm removed, followed by roughening. Ten specimens in each subgroup were repaired with the same or different composites, and MTBS tests were conducted. The surface roughness (Sa), and water contact angle of the remaining five specimens in each subgroup were measured. In every combination group, Group RT3 showed significantly higher MTBS values than Group RT1, and identical composite was not compulsory for higher repair bond strength. Removal thickness had no significant effect on the Sa in same composite group. In both the Z350 and APX groups, the water contact angle decreased with increasing removal thickness.

Funder

National Natural Science Foundation of China

Publisher

Frontiers Media SA

Subject

Materials Science (miscellaneous)

Cited by 1 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3