Alternative Form of Standard Linear Solid Model for Characterizing Stress Relaxation and Creep: Including a Novel Parameter for Quantifying the Ratio of Fluids to Solids of a Viscoelastic Solid
Author:
Funder
Ministry of Science and Technology, Taiwan
Publisher
Frontiers Media SA
Subject
Materials Science (miscellaneous)
Reference32 articles.
1. Biomaterial strategies for engineering implants for enhanced osseointegration and bone repair;Agarwal;Adv. Drug Deliver. Rev.,2015
2. A brief review of elasticity and viscoelasticity for solids;Banks;Adv. Appl. Math. Mech.,2011
3. Creep compliance mapping by atomic force microscopy;Braunsmann;Polymer,2014
4. Engineering hydrogel viscoelasticity;Cacopardo;J. Mech. Behav. Biomed.,2019
5. Fifty years of brain tissue mechanical testing: from in vitro to in vivo investigations;Chatelin;Biorheology,2010
Cited by 34 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Synthesis and characterization of SiO2 nanoparticles reinforced 3D printable gelatin/PVA/guar gum/ hydroxypropyl methylcellulose-based biocomposite hydrogel;Industrial Crops and Products;2024-10
2. Biomechanical Modelling of Porcine Kidney;Bioengineering;2024-05-24
3. Prediction of the low-pass filtering characteristics of viscoelastic polymer plates;Mechanical Systems and Signal Processing;2024-03
4. Computational Modelling and Analysis of Effect of Viscoelastic Materials on Damping and Vibrational Behaviors of Composite Structures—An Extensive Review;Archives of Computational Methods in Engineering;2024-02-06
5. Stress distribution in a multi-layer soft viscoelastic material under sliding motion of a spherical indenter tip;Mechanics of Time-Dependent Materials;2024-01-24
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3