Tailoring Scaffolds for Orthopedic Application With Anti-Microbial Properties: Current Scenario and Future Prospects

Author:

Preethi A.,Bellare Jayesh R.

Abstract

Research in the orthopedic application has attracted the scientific community to design and develop advanced, engineered synthetic scaffolds that possess all the essential cues properties necessary for successful regeneration and restoration of tissue function. Despite having the best surgical practices, nosocomial infections like surgical site infections can negatively impact the outcome of the scaffolds that are intended only for regenerative purposes. Therefore, there is a need to include anti-microbial properties as one of the parameters while designing a scaffold. There are various methods implemented to tackle microbial colonization such as modifying the scaffold surface that deflects microbes from surface adhesion and modifying the scaffold surface by inactivating microbes upon contact while maintaining the biocompatibility of the scaffold and also maintaining the scaffold viable for new bone formation. This review lists various anti-microbial polymers and compounds available in nature and methods to incorporate them into the scaffold with polymer and ceramics as the base material, without compromising bioactivity. We have reviewed various anti-microbial compounds, biomaterials and have also identified various biomolecules (vitamins, phytochemicals and anti-microbial peptides) that can be utilized for orthopedic application.

Publisher

Frontiers Media SA

Subject

Materials Science (miscellaneous)

Cited by 7 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3