Monitoring Damage Progression in Tensile Tested SiCp/Al Composites Using Acoustic Emission

Author:

Wu Weiguo,Wei Wei,Wang Yanju,Sha Aixue,Hao Wenfeng

Abstract

In this paper, the tensile tests of SiCp/Al composites were carried out, and the acoustic emission (AE) method was used to monitor the damage progress. The collected signals were analyzed in time-frequency domain. The AE signals were analyzed by principal component analysis (PCA) and fuzzy clustering method (FCM) to characterize the damage mode and failure mechanism of SiCp/Al composites. Three main damage modes of SiCp/Al composites were identified by FCM clustering: SiC/Al interface debonding, Al fracture and SiC particle fracture. After the tensile test, the fracture surface was analyzed by scanning electron microscope (SEM). The results of SEM and energy spectrum analysis confirmed the results of AE. The research results of this paper provide experimental support for the design and engineering application of SiCp/Al composites.

Publisher

Frontiers Media SA

Subject

Materials Science (miscellaneous)

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