Microbial Biodiversity and Bioremediation Assessment Through Omics Approaches

Author:

Chandran Hema,Meena Mukesh,Sharma Kanika

Publisher

Frontiers Media SA

Reference222 articles.

1. Microorganism as a tool of bioremediation technology for cleaning waste and industrial water;Abou Seeda;Biosci. Res.,2017

2. Solid phase DNA amplification: characterisation of primer attachment and amplification mechanisms;Adessi;Nucleic Acids Res,2000

3. Microbial metabolomics: innovation, application, insight;Aldridge;Curr. Opin. Microbiol.,2014

4. Targeted nucleotide editing technologies for microbial metabolic engineering;Arazoe;Biotechnol. J.,2018

5. Meta-omics provides insights into the impact of hydrocarbon contamination on microbial mat functioning;Aubé;Microb. Ecol.,2020

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