Development of Flexible Multilayer Circuit Board Fabrication Technology by Combining Laser Micromachining with Platinum Foil and Microwelding for Biomedical Applications-Reference-Cited by-同舟云学术

Development of Flexible Multilayer Circuit Board Fabrication Technology by Combining Laser Micromachining with Platinum Foil and Microwelding for Biomedical Applications

Published:2024 Issue:0 Volume:13 Page:108-115
ISSN:2187-5219
Container-title:Advanced Biomedical Engineering
language:en
Short-container-title:ABE

Author:

KONO Takuro¹²,TERASAWA Yasuo¹³,TASHIRO Hiroyuki²⁴,OHTA Jun²³

Affiliation:

1. Artificial Vision Institute, R&D Div., Nidek Co., Ltd.

2. Division of Materials Science, Nara Institute of Science and Technology

3. Institute for Research Initiatives, Nara Institute of Science and Technology

4. Division of Medical Technology, Department of Health Sciences, Faculty of Medical Sciences, Kyushu University

Publisher

Japanese Society for Medical and Biological Engineering

Link

https://www.jstage.jst.go.jp/article/abe/13/0/13_108/_pdf

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