Structural Contribution of Cold In-Place Recycling Base Layer

Author:

Carvajal Mateo E.,Piratheepan Murugaiyah,Sebaaly Peter E.,Hajj Elie Y.,Hand Adam J.

Abstract

Cold in-place recycling (CIR) of asphalt pavements is a process that has successfully been used for many years. The use of CIR for rehabilitation offers many advantages over traditional overlays due to its excellent resistance to reflective cracking and its environmentally friendly impacts. Despite the good performance and positive sustainability aspects of CIR, the structural contribution of the CIR base layer has not been well defined. In this research, CIR mixtures were designed with different asphalt emulsions. The mixtures were then subjected to dynamic modulus, repeated load triaxial, and flexural beam fatigue testing over a range of temperature and loading conditions. The performance test data generated were then used to develop CIR rutting and fatigue performance models used in the mechanistic analysis of flexible pavements. The technique used to develop the performance models leveraged the fact that the rutting and fatigue models for individual CIR mixtures were all within the 95 percent confidence interval of each other. A mechanistic analysis was conducted using the 3D-Move Mechanistic Analysis model. With the laboratory-developed performance models, the structural layer coefficient for the CIR base layer were developed for use in the 1993 AASHTO Guide for the Design of Pavement Structures. This analysis led to the determination of an average structural coefficient of the CIR base layer of 0.25.

Publisher

MDPI AG

Subject

General Earth and Planetary Sciences,General Environmental Science

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3