Combined Impact of the Lewis Number and Thermal Expansion on Laminar Flame Flashback in Tubes

Author:

Huang Kai12ORCID,Benteux Louis12,Han Wenhu3ORCID,Valiev Damir M.124ORCID

Affiliation:

1. Center for Combustion Energy, Tsinghua University, Beijing 100084, China

2. Key Laboratory for Thermal Science and Power Engineering of Ministry of Education, Department of Energy and Power Engineering, Tsinghua University, Beijing 100084, China

3. State Key Laboratory of Explosion Science and Technology, Beijing Institute of Technology, Beijing 100081, China

4. Department of Applied Physics and Electronics, Umeå University, SE 90187 Umeå, Sweden

Abstract

The understanding of the boundary layer flame flashback (BLF) has considerably improved in recent decades, driven by the increasing focus on clean energy and the need to address the operational issues associated with flashback. This study investigates the influence of the Lewis number (Le) on symmetric flame shapes under the critical conditions for a laminar boundary layer flashback in cylindrical tubes. It has been found that the transformation of the flame shape from a mushroom to a tulip happens in a tube of a given radius, as the thermal expansion coefficient and Le are modified. A smaller Lewis number results in a local increase in the burning rate at the flame tip, with the flame being able to propagate closer to the wall, which significantly increases the flashback propensity, in line with previous findings. In cases with a Lewis number smaller than unity, a higher thermal expansion results in a flame propagation happening closer to the wall, thus facing a weaker oncoming flow and, consequently, becoming more prone to flashback. For Le > 1, the effect of the increase in the thermal expansion coefficient on the flashback tendency is much less pronounced.

Funder

National Natural Science Foundation of China

State Key Laboratory of Explosion Science and Technology

Shaanxi Institute of Applied Physical Chemistry

Swedish National Infrastructure for Computing (SNIC) at High Performance Computing Center North

Swedish Research Council

MDPI

Publisher

MDPI AG

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