Photocurable High-Energy Polymer-Based Materials for 3D Printing

Author:

Tkachev Dmitrii1ORCID,Dubkova Yana1ORCID,Zhukov Alexander1,Verkhoshanskiy Yanis1,Vorozhtsov Alexander1,Zhukov Ilya1ORCID

Affiliation:

1. Laboratory of Metallurgy Nanotechnologies, National Research Tomsk State University, Lenin Avenue, 36, 634050 Tomsk, Russia

Abstract

Digital light processing (DLP) or stereolithography is the most promising method of additive manufacturing (3D printing) of products based on high-energy materials due to, first of all, the absence of a high-temperature impact on the material. This paper presents research results of an ultraviolet (UV)-cured urethane methacrylate polymer containing 70 wt.% of high-energy solid powder based on ammonium salts, which is intended for digital light processing. Polymerization of the initial slurry is studied herein. It is shown that the addition of coarse powder transparency for the UV radiation to resin increases its curing depth. The thickness of the layer, which can polymerize, varies from 600 µm to 2 mm when the light power density ranges from 20 to 400 mJ/cm2, respectively. In DLP-based 3D printing, the obtained material density is 92% of the full density, while the compressive strength is 29 ± 3 MPa, and the ultimate tensile strength is 13 ± 1.3 MPa. The thermogravimetric analysis shows the decrease in the thermal decomposition temperature of UV-cured resin with high-energy additives compared to the thermal decomposition temperatures of the initial components separately. Thermal decomposition is accompanied by intensive heat generation. The burning rate of obtained samples grows from 0.74 to 3.68 mm/s, respectively, at the pressure growth from 0.1 to 4 MPa. Based on the results, it can be concluded that DLP-based 3D printing with the proposed UV photocurable resin is rather promising for the fabrication of multicomponent high-energy systems and complex profile parts produced therefrom.

Funder

Russian Science Foundation

Publisher

MDPI AG

Subject

Polymers and Plastics,General Chemistry

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