Effects of Flat-Shaped Face Layer Particles and Core Layer Particles of Intentionally Greater Thickness on the Properties of Wood-Reduced Particleboard

Author:

Benthien Jan T.,Ohlmeyer Martin

Abstract

Against the background of the intention to reduce the amount of wood used in the production of particleboard for economic reasons, the associated reduction in panel density and consequently the panel properties, the influence of the alternative use of flat-shaped face layer particles and core layer particles of intentionally greater thickness on the panel properties was investigated. Appropriate particles were made for this purpose, panels with typical (650 kg/m3) and reduced wood usage (500 kg/m3) were produced, and e.g., their bending properties and internal bond strength were determined. Particle size characterization was done with sieve analysis, image analysis (length and width measurement), and manual thickness gauging. It was found that the alternative use of the flat-shaped particle significantly increased the bending properties and thus the level of the reference can be achieved despite the reduced use of wood. The reason for the increased bending properties was assumed to be the higher strength of the particles themselves and the more effective adhesive bond between the particles. The increase in internal bond strength when using alternative particles could be attributed solely the different production history (e.g., use of fresh cutting blades and laboratory scale production).

Funder

Fachagentur Nachwachsende Rohstoffe

Publisher

MDPI AG

Subject

Mechanics of Materials,Biomaterials,Civil and Structural Engineering,Ceramics and Composites

Reference28 articles.

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3