Pulsed Electrodeposition for Copper Nanowires

Abstract

Copper nanowires (Cu NWs) are a promising alternative to indium tin oxide (ITO), for use as transparent conductors that exhibit comparable performance at a lower cost. Furthermore, Cu NWs are flexible, a property not possessed by ITO. However, the Cu NW-based transparent electrode has a reddish color and tends to deteriorate in ambient conditions due to the oxidation of Cu. In this paper, we propose a pulsed-current (PC) plating method to deposit nickel onto the Cu NWs in order to reduce oxidation over a 30-day period, and to minimize the sheet resistance. Additionally, the effects of the pulse current, duty cycle, and pulse frequency on the performance of the Cu–Ni (copper–nickel) NW films have also been investigated. As a result, the reddish color of the electrode was eliminated, as oxidation was completely suppressed, and the sheet resistance was reduced from 35 Ω/sq to 27 Ω/sq. However, the transmittance decreased slightly from 86% to 76% at a wavelength of 550 nm. The Cu–Ni NW electrodes also exhibited excellent long-term cycling stability after 6000 bending cycles. Our fabricated Cu–Ni electrodes were successfully applied in flexible polymer-dispersed liquid crystal smart windows.