Research on Constitutive Model and Algorithm of High-Temperature-Load Coupling Damage Based on the Zienkiewicz–Pande Yield Criterion
-
Published:2023-08-29
Issue:17
Volume:13
Page:9786
-
ISSN:2076-3417
-
Container-title:Applied Sciences
-
language:en
-
Short-container-title:Applied Sciences
Author:
Zhan Tao1,
Jiang Tengfei2,
Shan Shengbiao1,
Zheng Fu2,
Jiang Annan2ORCID,
Guo Xinping2
Affiliation:
1. Nanchang Rail Transit Group Co., Ltd., Nanchang 330013, China
2. Institute of Road and Bridge Engineering, Dalian Maritime University, Dalian 116026, China
Abstract
The mechanical properties of rock can be weakened under the influence of high temperatures. To describe the mechanical behavior of rock under the action of high temperature more accurately, based on the Zienkiewicz–Pande yield criterion, the damage variable Dc which accounts for the coupling between high temperature and load is introduced. According to plastic potential theory and plastic flow law, the iterative incremental method for a high-temperature and load-coupled damage constitutive model in Flac3D is deduced in detail and compiled into the corresponding dynamic link library file (.dll file). By modifying the shape function to degenerate into the Mohr–Coulomb constitutive model, an elastic–plastic analysis of an ideal circular tunnel is performed, and a comparison is made between calculation results obtained from the built-in Mohr–Coulomb constitutive model in Flac3D, proving the correctness of the secondary development program. Finally, numerical simulations are conducted to study the effects of high-temperature damage using rock uniaxial compression tests, and the model’s validity is established by comparing it with previous experimental results.
Funder
National Natural Science Foundation of China
LiaoNing Revitalization Talents Program
Cultivation Program for the Excellent Doctoral Dissertation of Dalian Maritime University
Jiangxi Province High Level and Skilled Leading Talent Training Project Candidate Project
Subject
Fluid Flow and Transfer Processes,Computer Science Applications,Process Chemistry and Technology,General Engineering,Instrumentation,General Materials Science