Alternative Fiber-Based Paperboard Adhesion Evaluation with T- and Y-Peel Testing

Author:

Kavčič Urška1ORCID,Lavrič Gregor1ORCID,Karlovits Igor1

Affiliation:

1. Pulp and Paper Institute, 1000 Ljubljana, Slovenia

Abstract

Due to increased pressure on the availability of wood biomass in the EU and the regulatory attempts to lower CO2 values, where wood-based biomass plays a crucial role in carbon sequestration, the use of cellulose derived from alternative sources is gaining increased interest in the pulp and paper industry as well as in other industries. The processing properties of alternative fiber-based packaging need to be checked in current processing operations with other types of materials and recycling workflows. For example, in the production of folding boxes, after printing other converting properties such as glueability are also of great importance. The adhesive absorption and bonding strength of materials are important as adhesive joints of packaging can interfere with the protective function. In the presented research, three different paperboards produced on a pilot scale from alternative raw material sources were tested. Two paperboards were produced from the alien invasive plants Japanese knotweed and black locust, and one from residual sawdust. The basic paperboard properties were tested regarding paperboard porosity, roughness, z-directional tensile strength, and dynamical behavior regarding liquid interaction (contact angle and liquid penetration dynamic), as water-based adhesives were used in the research. For adhesive joint strength testing, Y- and T-peel adhesion testing was performed on the joint paperboard samples, as still there is no fully standardized method for the evaluation of such fiber-based material properties. The results indicate differences in the penetration dynamics of liquids. This parameter had the highest influence on the peel adhesion strength, while porosity, roughness, and dynamic contact angle were not so significant. Regarding the two adhesive joint tests, the differences in separate materials regarding peel adhesion curves show similar results. However, the Y-peel maximum force values are higher due to the testing setup (in comparison to the T-peel test). The paperboards made from invasive plants showed adhesive joint failures which are more suitable for tamper-proof packaging due to their low surface strength and crack propagation into the fiber structure.

Publisher

MDPI AG

Subject

Fluid Flow and Transfer Processes,Computer Science Applications,Process Chemistry and Technology,General Engineering,Instrumentation,General Materials Science

Reference26 articles.

1. Y-peel characterization of adhesively-bonded carton board: An objective method;Korin;J. Adhes. Sci. Technol.,2007

2. Assuring successful bonding to carton boards;Shires;Packag. Technol. Sci.,1988

3. (2023, July 31). emtec PDA Penetration Dynamics Analyzer. Available online: https://www.emtec-electronic.de/images/stories/infomaterial/04_PDA.C02_alle_Module/01_PDA_MST/02_Booklet/01_EN/emtec_PDA_Penetration_Dynamics_Analyzer_MST_booklet_en.pdf.

4. Influence of paper properties on adhesive strength of starch gluing;Dohr;Nord. Pulp Pap. Res. J.,2022

5. The effect of decor paper properties and adhesive type on some properties of particleboard;Bardak;Int. J. Adhes. Adhes.,2011

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3