Design and Analysis of Ultra-Precision Smart Cutting Tool for In-Process Force Measurement and Tool Nanopositioning in Ultra-High-Precision Single-Point Diamond Turning

Author:

Hatefi Shahrokh1ORCID,Smith Farouk1ORCID

Affiliation:

1. Department of Mechatronics, Faculty of Engineering, the Built Environment and Technology, Nelson Mandela University, Port Elizabeth 6000, South Africa

Abstract

Ultra-high-precision single-point diamond turning (SPDT) is the state-of-the-art machining technology for the advanced manufacturing of critical components with an optical surface finish and surface roughness down to one nanometer. One of the critical factors that directly affects the quality of the diamond-cutting process is the cutting force. Increasing the cutting force can induce tool wear, increase the cutting temperature, and amplify the positioning errors of the diamond tool caused by the applied cutting force. It is important to measure the cutting force during the SPDT process to monitor the tool wear and surface defects in real time. By measuring the cutting force in different cutting conditions, the optimum cutting parameters can be determined and the best surface accuracies with minimum surface roughness can be achieved. In this study a smart cutting tool for in-process force measurement and nanopositioning of the cutting tool for compensating the displacements of the diamond tool during the cutting process is designed and analyzed. The proposed smart cutting tool can measure applied forces to the diamond tool and correct the nanometric positioning displacements of the diamond tool in three dimensions. The proposed cutting tool is wireless and can be used in hybrid and intelligent SPDT platforms to achieve the best results in terms of optical surface finish. The simulation results are shown to be almost consistent with the results of the derived analytical model. The preliminary results pave the way for promising applications of the proposed smart cutting tool in SPDT applications in the future.

Publisher

MDPI AG

Subject

Electrical and Electronic Engineering,Mechanical Engineering,Control and Systems Engineering

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