Affiliation:
1. Institute of Railway and Urban Mass Transit, Tongji University, Shanghai 201804, China
2. School of Urban Rail Transportation, Shanghai University of Engineering Science, Shanghai 201620, China
3. College of Urban Transportation and Logistics, Shenzhen Technology University, Shenzhen 518118, China
Abstract
Surface cracks are typical defects in high-speed rail (HSR) slab tracks, which can cause structural deterioration and reduce the service reliability of the track system. However, the question of how to effectively detect and quantify the surface cracks remains unsolved at present. In this paper, a novel crack-detection method based on infrared thermography is adopted to quantify surface cracks on rail-track slabs. In this method, the thermogram of a track slab acquired by an infrared camera is first processed with the non-subsampled contourlet transform (NSCT)-based image-enhancement algorithm, and the crack is located via an edge-detection algorithm. Next, to quantitatively detect the surface crack, a pixel-locating method is proposed, whereby the crack width, length, and area can be obtained. Lastly, the detection accuracy of the proposed method at different temperatures is verified against a laboratory test, in which a scale model of the slab is poured and a temperature-controlled cabinet is used to control the temperature-change process. The results show that the proposed method can effectively enhance the edge details of the surface cracks in the image and that the crack area can be effectively extracted; the accuracy of the quantification of the crack width can reach 99%, whilst the accuracy of the quantification of the crack length and area is 85%, which essentially meets the requirements of HSR-slab-track inspection. This research could open the possibility of the application of IRT-based track slab inspection in HSR operations to enhance the efficiency of defect detection.
Funder
National Natural Science Foundation of China
Innovation Initiative Programme of Shanghai
Subject
Fluid Flow and Transfer Processes,Computer Science Applications,Process Chemistry and Technology,General Engineering,Instrumentation,General Materials Science
Cited by
2 articles.
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