Beyond Conventional Sensing: Hybrid Plasmonic Metasurfaces and Bound States in the Continuum
Author:
Affiliation:
1. Center for High Technology Materials, University of New Mexico, 1313 Goddard St SE, Albuquerque, NM 87106-4343, USA
2. Electrical and Computer Engineering Department, University of New Mexico, Albuquerque, NM 87106-4343, USA
Abstract
Funder
University of New Mexico
U.S. Department of Energy with Contracts
Publisher
MDPI AG
Subject
General Materials Science,General Chemical Engineering
Link
https://www.mdpi.com/2079-4991/13/7/1261/pdf
Reference52 articles.
1. Metasurface Micro/Nano-Optical Sensors: Principles and Applications;Qin;ACS Nano,2022
2. Universal scaling of the figure of merit of plasmonic sensors;Offermans;ACS Nano,2011
3. Ab initio theory of Fano resonances in plasmonic nanostructures and metamaterials;Gallinet;Phys. Rev. B,2011
4. Fano resonances in photonics;Limonov;Nat. Photonics,2017
5. Relation between near–field and far–field properties of plasmonic Fano resonances;Gallinet;Opt. Express,2011
Cited by 6 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Lattice Mie resonances and emissivity enhancement in mid-infrared iron pyrite metasurfaces;Optics Express;2023-11-14
2. Hybrid Metasurface with Multipole Resonances for Improved Sensing;2023 IEEE Research and Applications of Photonics in Defense Conference (RAPID);2023-09
3. Multipole Mie Resonances in MXene-Antenna Arrays;The Journal of Physical Chemistry C;2023-08-30
4. Optical Processes behind Plasmonic Applications;Nanomaterials;2023-04-03
5. Lattice Resonances in Dielectric Antenna Arrays with Finite Dimensions;Optica Imaging Congress (3D, COSI, DH, FLatOptics, IS, pcAOP);2023
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3