An Improved Analytical Thermal Rating Method for Cable Joints

Author:

He Fawu1,Xie Yue2,Wang Pengyu2,Wu Zhiheng34,Bao Shuzhen35,Wang Wei6,Xu Xiaofeng7,Meng Xiaokai6,Liu Gang3ORCID

Affiliation:

1. School of Electric Power, Guangzhou Railway Polytechnic, Guangzhou 511300, China

2. School of Automation, Guangdong Polytechnic Normal University, Guangzhou 510665, China

3. School of Electric Power, South China University of Technology, Guangzhou 510640, China

4. Zhuhai Power Supply Bureau, Guangdong Power Grid Co., Ltd., Guangzhou 519099, China

5. State Grid Fuzhou Power Electric Supply Company, Fuzhou 350000, China

6. State Grid Shanxi Electric Power Research Institute, Taiyuan 030600, China

7. State Key Laboratory of Special Cable Technology, Shanghai Electric Cable Research Institute Co., Ltd., Shanghai 200093, China

Abstract

To improve the utilization rate of cable lines while retaining sufficient security, the accurate thermal assessment of cable is significant for cable operation condition evaluation. The thermal rating for a cable joint, which is regarded as a hot spot of cable lines, is not covered by the scope of IEC 60287. While the existing publications for cable joint thermal evaluation also have some limitations. In this paper, the quasi-three-dimensional thermal model of the cable joint was established and the iterative solution method for the model is presented. Based on the model, an improved thermal rating method for the cable joint was proposed, which was implemented with monitored surface temperature and load data. The improved method was verified by the finite element method and the results showed an error of less than 5%. The superiority of the improved method was conducted by the comparison between the previously published method and the improved method. The improved method showed a better accuracy than the previously published method. The proposed method in this paper can be complementary to the IEC method, and is easy to use for the operating evaluation of cable joints in the field with the on-line condition monitoring technology.

Publisher

MDPI AG

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