1. Overview of Advanced IC Packaging Technology;Zhou;Appl. IC,2018
2. The Future Technology Trends of Integrated Circuit Packaging and Testing Industry and Its Development in China;Zhou;Electron. Packag.,2015
3. A new failure mechanism of electromigration by surface diffusion of Sn on Ni and Cu metallization in microbumps;Chang;Sci. Rep.,2018
4. Asgari, R. (2002, January 17–18). Semiconductor backend flip chip processing, inspection requirements and challenges. Proceedings of the 27th Annual IEEE/SEMI International Electronics Manufacturing Technology Symposium, San Jose, CA, USA.
5. Micro inspection for wafer bumping: Inspection requirements for wafer-level packaging processes;Hiebert;Adv. Packag.,2002