Topology Structural Design and Thermal Characteristics Analysis of High-Efficiency Heat Conductive Path for the Spindle System

Author:

Li Yang1ORCID,Liu Zhongting2,Li Lei2,He Wenlei2,Hou Zhaoyang2,Zhao Wanhua1,Wu Wenwu3

Affiliation:

1. State Key Laboratory for Manufacturing Systems Engineering, Xi’an Jiaotong University, Xi’an 710054, China

2. School of Mechanical Engineering, Xi’an Jiaotong University, Xi’an 710054, China

3. Key Laboratory of NC Machine Tools and Integrated Manufacturing Equipment of the Education Ministry & Key Laboratory of Manufacturing Equipment of Shaanxi Province, Xi’an 710048, China

Abstract

In order to enhance the heat dissipation of the spindle under working condition, thermal conductivity paths were designed based on the topology optimization method. The heat conductive path was proposed to be constructed in the bearing housing and the spindle housing, which was simplified as a toroidal model. Taking the heat dissipation weakness as the optimization objective, the topological structure with the highest thermal conductivity was obtained based on the OC and IPTO algorithms. In order to analyze the influence of the heat conductive path on the circumferential heat distribution of the spindle, the thermal characteristic of the model with heat conductive paths filled with copper was investigated. Compared with the general model, the heat conductive path could reduce the temperature of the spindle from 47 °C to 33 °C when the volume proportion of the high thermal conductivity material was 40%. At the same time, the strength of the heat conductive path was analyzed, and the size of the stress was not more than 3MPa, which verified the effectiveness of the heat conductive path for efficient heat conduction.

Funder

Natural Science Foundation of China

National Natural Science Foundation of Shaanxi Province

Key-Area Research and Development Program of Guangdong Province

Publisher

MDPI AG

Subject

Process Chemistry and Technology,Chemical Engineering (miscellaneous),Bioengineering

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3