1. Nanjing Electronic Devices Institute, Nanjing 210016, China
2. College of Electronic and Information Engineering, Southwest University, Chongqing 400715, China
3. Henan Province Engineering Research Center of Ultrasonic Technology Application, Pingdingshan University, Pingdingshan 467036, China
4. Shanghai Key Laboratory of Special Artificial Microstructure Materials and Technology, School of Physics Science and Engineering, Tongji University, Shanghai 200092, China