PAtCH: Proactive Approach to Circumvent Holes in Wireless Sensor Networks

Author:

Lima Moyses M.1ORCID,Sardinha Eduardo D.2ORCID,Balico Leandro N.3ORCID,Oliveira Horacio A. B. F.4ORCID

Affiliation:

1. Retail Management System Technical Group, SIDIA R&D Institute, Manaus 69055-035, Brazil

2. Application Technical Group, SIDIA R&D Institute, Manaus 69055-035, Brazil

3. Department of Computer Science, Federal University of Roraima, Boa Vista 69310-000, Brazil

4. Institute of Computing, Federal University of Amazonas, Manaus 69080-900, Brazil

Abstract

The occurrence of hole regions in Wireless Sensor Networks is a significant challenge when applying a greedy technique in a geographic routing approach. The local minimum phenomenon is commonly attributed to physical obstacles, energy depletion of the nodes, failures in communication between neighbors, or even the incorrect deployment of the nodes in the sensing field. To address the problem of hole regions, most approaches choose to abandon the traditional greedy forwarding mechanism to temporarily adopt the well-known perimeter routing scheme applied to nearby nodes or along the edge of a region of a hole. However, this mechanism does not satisfy the network load balance requirement, because it imposes too much traffic to the nodes in the hole’s edge, making them overloaded when compared to other network nodes more distant from holes. In this work, we propose a novel location-free geographic routing technique called PAtCH (Proactive Approach to Circumvent Holes in Wireless Sensor Network) to avoid routing holes in WSNs. Our solution can circumvent hole regions and create routing paths toward the destination. We consider that our sink has a higher communication range, and the Received Signal Strength Indicator (RSSI) is used to assist the construction of the routing paths. Our results show the efficiency achieved by our proposed solution in scenarios with hole regions, also maintaining all the benefits of a classic greedy forwarding technique.

Funder

Samsung Eletrônica da Amazônia Ltda

Publisher

MDPI AG

Subject

Electrical and Electronic Engineering,Biochemistry,Instrumentation,Atomic and Molecular Physics, and Optics,Analytical Chemistry

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