Thermal Nanoimprint Lithography—A Review of the Process, Mold Fabrication, and Material

Author:

Unno Noriyuki1,Mäkelä Tapio2

Affiliation:

1. Department of Applied Electronics, Tokyo University of Science, 6-3-1 Niijuku, Katsushika-ku, Tokyo 125-8585, Japan

2. VTT Printed and Hybrid Functionalities, Tietotie 3, P.O. Box 1000, FI-02044 VTT Espoo, Finland

Abstract

Micro- and nanopatterns perform unique functions and have attracted attention in various industrial fields, such as electronic devices, microfluidics, biotechnology, optics, sensors, and smart and anti-adhesion surfaces. To put fine-patterned products to practical use, low-cost patterning technology is necessary. Nanoimprint lithography (NIL) is a promising technique for high-throughput nanopattern fabrication. In particular, thermal nanoimprint lithography (T-NIL) has the advantage of employing flexible materials and eliminating chemicals and solvents. Moreover, T-NIL is particularly suitable for compostable and recyclable materials, especially when applying biobased materials for use in optics and electronics. These attributes make T-NIL an eco-friendly process. However, the processing time of normal T-NIL is longer than that of ultraviolet (UV) NIL using a UV-curable resin because the T-NIL process requires heating and cooling time. Therefore, many studies focus on improving the throughput of T-NIL. Specifically, a T-NIL process based on a roll-to-roll web system shows promise for next-generation nanopatterning techniques because it enables large-area applications with the capability to process webs several meters in width. In this review, the T-NIL process, roll mold fabrication techniques, and various materials are introduced. Moreover, metal pattern transfer techniques using a combination of nanotransfer printing, T-NIL, and a reverse offset are introduced.

Publisher

MDPI AG

Subject

General Materials Science,General Chemical Engineering

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