Experimental Study on Pot Damage and Contact Stress Distribution Characteristics of Oil Sunflower Plug Seedlings

Author:

Zeng FandiORCID,Li Xuying,Bai Hongbin,Cui Ji,Liu Xuening,Zhang Yongzhi

Abstract

To reveal the collision damage mechanisms of plug seedlings and improve the quality of seedlings, the kinetics equations of the plug seedlings were established based on the generalized Hertz-theory. The influence laws of different factors on pot damage were obtained through a drop impact test. The Tekscan pressure distribution measurement system measured the collision impact force, and the orthogonal tests were conducted. The test showed that the influence of the collision impact force was on the order of plug specification > drop height > contact material. The Tekscan pressure distribution measurement system measured the change law of contact stress distribution under significant influencing factors. The test results showed that the collision contact area between the plug seedlings and contact materials from large to small was soil, steel, and ABS plastic. The collision contact area between the plug seedlings and other plug specifications was 50 plug, 72 plug, and 105 plug from the largest to the smallest. When the plug seedlings collided with contact materials, the average contact stress between the seedlings and the steel plate ranged from 19.4 kPa to 22.8 kPa. When the plug seedlings of various sizes collided with steel plates, the average contact stress was ordered as 105 plug, 72 plug and 50 plug in descending order. A linear regression model between collision impact force and matrix loss rate under different factors was established based on the pressure data collected by the Tekscan pressure distribution measurement system. This study provides a basis for exploring the impact damage mechanisms of plug seedlings and improving the seedling quality.

Funder

National Natural Science Foundation of China

Natural Science Foundation of the Inner Mongolia Autonomous Region of China

Publisher

MDPI AG

Subject

Fluid Flow and Transfer Processes,Computer Science Applications,Process Chemistry and Technology,General Engineering,Instrumentation,General Materials Science

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