Finite Element-Based Machine Learning Model for Predicting the Mechanical Properties of Composite Hydrogels

Author:

Shokrollahi YasinORCID,Dong Pengfei,Gamage Peshala T.,Patrawalla Nashaita,Kishore VipuilORCID,Mozafari Hozhabr,Gu LinxiaORCID

Abstract

In this study, a finite element (FE)-based machine learning model was developed to predict the mechanical properties of bioglass (BG)-collagen (COL) composite hydrogels. Based on the experimental observation of BG-COL composite hydrogels with scanning electron microscope, 2000 microstructural images with randomly distributed BG particles were created. The BG particles have diameters ranging from 0.5 µm to 1.5 µm and a volume fraction from 17% to 59%. FE simulations of tensile testing were performed for calculating the Young’s modulus and Poisson’s ratio of 2000 microstructures. The microstructural images and the calculated Young’s modulus and Poisson’s ratio by FE simulation were used for training and testing a convolutional neural network regression model. Results showed that the network developed in this work can effectively predict the mechanical properties of the composite hydrogels. The R-squared values were 95% and 83% for Young’s modulus and Poisson’s ratio, respectively. This work provides a surrogate model of finite element analysis to predict mechanical properties of BG-COL hydrogel using microstructure images, which could be further utilized for characterizing heterogeneous materials in big data-driven material designs.

Publisher

MDPI AG

Subject

Fluid Flow and Transfer Processes,Computer Science Applications,Process Chemistry and Technology,General Engineering,Instrumentation,General Materials Science

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3