Co-Design Method and Wafer-Level Packaging Technique of Thin-Film Flexible Antenna and Silicon CMOS Rectifier Chips for Wireless-Powered Neural Interface Systems-Reference-Cited by-同舟云学术

Co-Design Method and Wafer-Level Packaging Technique of Thin-Film Flexible Antenna and Silicon CMOS Rectifier Chips for Wireless-Powered Neural Interface Systems

Published:2015-12-16 Issue:12 Volume:15 Page:31821-31832
ISSN:1424-8220
Container-title:Sensors
language:en
Short-container-title:Sensors

Author:

Okabe Kenji,Jeewan Horagodage,Yamagiwa Shota,Kawano Takeshi,Ishida Makoto,Akita Ippei

Publisher

MDPI AG

Subject

Electrical and Electronic Engineering,Biochemistry,Instrumentation,Atomic and Molecular Physics, and Optics,Analytical Chemistry

Link

http://www.mdpi.com/1424-8220/15/12/29885/pdf

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