Fabrication of Bulk Tungsten Microstructure Arrays for Hydrophobic Metallic Surfaces Using Inductively Coupled Plasma Deep Etching

Author:

Wang Zetian12,Xia Yanming3,Song Lu12,Chen Jing4,Wang Wei12

Affiliation:

1. School of Integrated Circuits, Peking University, Beijing 100871, China

2. National Key Laboratory of Advanced Micro and Nano Manufacture Technology, Beijing 100871, China

3. Guangzhou National Laboratory, Guangzhou 510005, China

4. Hicomp MicroTech Co., Ltd., Suzhou 215028, China

Abstract

Hydrophobic surfaces have attracted great attention due to their ability to repel water, and metallic surfaces are particularly significant as they have several benefits, for example they self-clean and do not corrode in marine environments, but also have several applications in the aircraft, building and automobile industries. Tungsten is an ideal material for metallic surfaces due to its remarkable mechanical properties. However, conventional micromachining methods of micro- or nanostructures, including mechanical fabrication and laser and wet etching are incapable of balancing functionality, consistency and cost. Inspired by the etching process of silicon, deep etching of bulk tungsten has been developed to achieve versatile microstructures with the advantages of high efficiency, large scale and low cost. In this article, fabrication methods of tungsten-based hydrophobic surfaces using an ICP deep etching process were proposed. Micro- or hierarchical structure arrays with controllable sidewall profiles were fabricated by optimizing etching parameters, which then exhibited hydrophobicity with contact angles of up to 131.8°.

Publisher

MDPI AG

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