Thermal Performance of Heat Sink Filled with Double-Porosity Porous Aluminum Skeleton/Paraffin Phase Change Material

Abstract

Phase change materials (PCMs) are used to cool high-power-density electronic devices because of their high latent heat and chemical stability. However, their low thermal conductivity limits the application of PCMs. To solve this problem, a double-porosity porous aluminum skeleton/paraffin phase change materials (DPAS/PCM) was prepared via additive manufacturing and the water-bath method. The thermal performance of the DPAS/PCM heat sink (HS) was experimentally investigated to examine the effects of the positive- and reverse-gradient porosity structures of the DPAS/PCM. The results show that a positive-gradient porosity arrangement is more conducive to achieving a low-temperature cooling target for LED operation. In particular, the temperature control time for the positive gradient porosity structure increased by 4.6–13.7% compared with the reverse gradient porosity structure. Additionally, the thermal performances of uniform porous aluminum skeleton/paraffin (UAS) and DPAS/PCMs were investigated. The temperature control effect of the DPAS/PCM was better than that of the UAS/PCM HS at high critical temperatures. Compared with the UAS/PCM HS, the temperature control time of the DPAS/PCM HS is increased by 7.8–12.5%. The results of this work show that the prepared DPAS/PCM is a high-potential hybrid system for thermal management of high-power electronic devices.