Editorial for the Special Issue on Recent Advances in Reactive Ion Etching and Applications of High-Aspect-Ratio Microfabrication
Author:
Affiliation:
1. Institute for Biomedical Engineering, University and ETH Zürich, 8092 Zürich, Switzerland
2. Paul Scherrer Institute, 5232 Villigen, Switzerland
Abstract
Publisher
MDPI AG
Subject
Electrical and Electronic Engineering,Mechanical Engineering,Control and Systems Engineering
Link
https://www.mdpi.com/2072-666X/14/8/1630/pdf
Reference10 articles.
1. Huff, M. (2021). Recent Advances in Reactive Ion Etching and Applications of High-Aspect-Ratio Microfabrication. Micromachines, 12.
2. Baklykov, D.A., Andronic, M., Sorokina, O.S., Avdeev, S.S., Buzaverov, K.A., Ryzhikov, I.A., and Rodionov, I.A. (2021). Self-Controlled Cleaving Method for Silicon DRIE Process Cross-Section Characterization. Micromachines, 12.
3. Zhang, Y., Hou, Z., Si, C., Han, G., Zhao, Y., Lu, X., Liu, J., Ning, J., and Yang, F. (2023). Effects of Mask Material on Lateral Undercut of Silicon Dry Etching. Micromachines, 14.
4. Gerlt, M.S., Läubli, N.F., Manser, M., Nelson, B.J., and Dual, J. (2021). Reduced Etch Lag and High Aspect Ratios by Deep Reactive Ion Etching (DRIE). Micromachines, 12.
5. Tillocher, T., Nos, J., Antoun, G., Lefaucheux, P., Boufnichel, M., and Dussart, R. (2021). Comparison between Bosch and STiGer Processes for Deep Silicon Etching. Micromachines, 12.
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