Versatility Investigation of Grown Titanium Dioxide Nanoparticles and Their Comparative Charge Storage for Memristor Devices

Author:

Chakrabartty Shubhro1ORCID,Almawgani Abdulkarem H. M.2ORCID,Kumar Sachin3ORCID,Kumar Mayank4ORCID,Acharjee Suvojit5,Al-Shidaifat Alaaddin6ORCID,Poulose Alwin7ORCID,Alsuwian Turki2ORCID

Affiliation:

1. Department of Electronics and Communication Engineering, Koneru Lakshmaiah Education Foundation University (K L College of Engineering), Vaddeswaram 522302, Andhra Pradesh, India

2. Electrical Engineering Department, College of Engineering, Najran University, Najran 66439, Saudi Arabia

3. Department of Electronics and Communication Engineering, SRM Institute of Science and Technology, Kattankulathur 603203, Tamil Nadu, India

4. Technical Research Analyst (TRA), Electronics/Biomedical Engineering, Aranca, Mumbai 400076, Maharashtra, India

5. Department of Electronic and Communication Engineering, Narula Institute of Technology, Agarpara, Kolkata 700109, West Bengal, India

6. Department of Nanoscience and Engineering, Centre for Nano Manufacturing, Inje University, Gimhae 50834, Republic of Korea

7. School of Data Science, Indian Institute of Science Education and Research Thiruvananthapuram (IISER TVM), Vithura, Thiruvananthapuram 695551, Kerala, India

Abstract

Memristive devices have garnered significant attention in the field of electronics over the past few decades. The reason behind this immense interest lies in the ubiquitous nature of memristive dynamics within nanoscale devices, offering the potential for revolutionary applications. These applications span from energy-efficient memories to the development of physical neural networks and neuromorphic computing platforms. In this research article, the angle toppling technique (ATT) was employed to fabricate titanium dioxide (TiO2) nanoparticles with an estimated size of around 10 nm. The nanoparticles were deposited onto a 50 nm SiOx thin film (TF), which was situated on an n-type Si substrate. Subsequently, the samples underwent annealing processes at temperatures of 550 °C and 950 °C. The structural studies of the sample were done by field emission gun-scanning electron microscope (FEG-SEM) (JEOL, JSM-7600F). The as-fabricated sample exhibited noticeable clusters of nanoparticles, which were less prominent in the samples annealed at 550 °C and 950 °C. The element composition revealed the presence of titanium (Ti), oxygen (O2), and silicon (Si) from the substrate within the samples. X-ray diffraction (XRD) analysis revealed that the as-fabricated sample predominantly consisted of the rutile phase. The comparative studies of charge storage and endurance measurements of as-deposited, 550 °C, and 950 °C annealed devices were carried out, where as-grown device showed promising responses towards brain computing applications. Furthermore, the teaching–learning-based optimization (TLBO) technique was used to conduct further comparisons of results.

Funder

Deanship of Scientific Research at Najran University

Publisher

MDPI AG

Subject

Electrical and Electronic Engineering,Mechanical Engineering,Control and Systems Engineering

Reference21 articles.

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