Effect of Total Dose Irradiation on Parasitic BJT in 130 nm PDSOI MOSFETs

Author:

Jia Yupeng12,Zhang Zhengxuan1,Bi Dawei1,Hu Zhiyuan1,Zou Shichang1

Affiliation:

1. Shanghai Institute of Microsystems and Information Technology, Chinese Academy of Sciences, Shanghai 200050, China

2. University of Chinese Academy of Sciences, Beijing 100049, China

Abstract

In this work, the effects of total dose irradiation on the parasitic bipolar junction transistor (BTJ) in 130 nm PDSOI MOSFETs were investigated. The experimental results demonstrate that irradiation-induced oxide-trap charges can modify the E-B junction barrier, and thereby make the common-emitter gain β0 of the parasitic BJT in NMOS device increase, while decreasing it in a PMOS device. Additionally, irradiation-generated oxide-trap charges in shallow trench isolation (STI) elevate the surface electrostatic potential of the gate above the STI sidewall, thus providing an additional channel from the emitter to the collector. Moreover, these charges may generate parasitic reverse conductive paths at the STI/Si interface under high dose irradiation, thereby enhancing the leakage current in the front gate channel and diminishing the significance of the parasitic BJT. Under irradiation, the electric field intensity difference between two biases leads to higher β0 of the parasitic BJT in PG-biased devices than in ON-biased ones. Furthermore, the lifting effect of irradiation on β0 increases in wide or short channel irradiated devices, which can be explained using simulations and an emitter current crowding effect model.

Publisher

MDPI AG

Subject

Electrical and Electronic Engineering,Mechanical Engineering,Control and Systems Engineering

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