Temperature–Stress Coupling Fatigue Behavior of Film-Cooling Holes in Complex Temperature Fields

Author:

Zhang Dongxu1ORCID,Xin Zhenyu1ORCID,Luo Zhuang1

Affiliation:

1. College of Mechanical and Electrical Engineering, Shaanxi University of Science & Technology, Xi’an 710021, China

Abstract

This research investigates the complex temperature distribution and fatigue behavior of single film-cooling holes manufactured by lasers with different pulse widths in a real flow field. The aerodynamic and heat transfer characteristics of film-cooling holes manufactured using lasers with different pulse widths were analyzed through laser drilling experiments, conjugate heat transfer simulations, and crystal plasticity finite element methods. The study investigated the relationship between changes in the geometric accuracy of the film-cooling holes and the corresponding flow and temperature fields during the film-cooling process. Additionally, the effects of temperature and structural variations on the stress around the holes in a flat plate composed of the second-generation nickel-based single-crystal superalloy DD6 in real flow and temperature fields were studied. The coupling effect of the temperature and stress fields around the holes on the fatigue behavior of the film-cooling holes was examined, and the fatigue damage mechanism of film-cooling holes in complex temperature fields was analyzed. It was found that changes in the blowing ratio do not affect the temperature and stress distributions around the holes but only alter the temperature peak. An increase in the temperature peak results in a decrease in the stress peak. Additionally, the fatigue damage of single film-cooling holes is determined by both the structural defects of the holes and the changes in material behavior due to the temperature around the holes, with the structural influence being more significant.

Funder

National Natural Science Foundation of China

Natural Science Basic Research Program of Shaanxi

Youth Innovation Team of Shaanxi Universities

Publisher

MDPI AG

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