A Strategy for Fabricating Ultra-Flexible Thermoelectric Films Using Ag2Se-Based Ink

Author:

Yuan Yunhuan1ORCID,Ding Chaogang2ORCID,Yin Rui1,Lu Shun3ORCID,Xu Jie2,Ren Wei4,Li Kang1ORCID,Zhao Weiwei12

Affiliation:

1. Flexible Printed Electronics Technology Center, Harbin Institute of Technology, Shenzhen 518055, China

2. Key Laboratory of Micro-Systems and Micro-Structures Manufacturing of Ministry of Education, Harbin Institute of Technology, Harbin 150001, China

3. Chongqing Institute of Green and Intelligent Technology, Chinese Academy of Sciences, Chongqing 400714, China

4. Changsha Semiconductor Technology and Application Innovation Research Institute, College of Semiconductors, Hunan University, Changsha 410082, China

Abstract

Flexible thermoelectric materials have drawn significant attention from researchers due to their potential applications in wearable electronics and the Internet of Things. Despite many reports on these materials, it remains a significant challenge to develop cost-effective methods for large-scale, patterned fabrication of materials that exhibit both excellent thermoelectric performance and remarkable flexibility. In this study, we have developed an Ag2Se-based ink with excellent printability that can be used to fabricate flexible thermoelectric films by screen printing and low-temperature sintering. The printed films exhibit a Seebeck coefficient of −161 μV/K and a power factor of 3250.9 μW/m·K2 at 400 K. Moreover, the films demonstrate remarkable flexibility, showing minimal changes in resistance after being bent 5000 times at a radius of 5 mm. Overall, this research offers a new opportunity for the large-scale patterned production of flexible thermoelectric films.

Funder

Natural Science Foundation of China

Shenzhen Peacock Team Plan

Publisher

MDPI AG

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