Wetting Behavior and Maximum Retention of Aqueous Surfactant Solutions on Tea Leaves

Abstract

In this research, the maximum retention and wetting behavior of surfactant solutions (N-200, N-300, Tween-80, Morwet EFW, DTAB, SDS) on the surfaces of tea leaves was investigated based on surface free energy, surface tension, the contact angle, adhesion work, and adhesion force. The results showed that the contact angles of all surfactant solutions were kept constant with low adsorption at the tea leaf–liquid interfaces below 0.005%. With an increase in concentration, the contact angle of Tween-80 decreased sharply because the adsorption of molecules at the solid–liquid interfaces (ΓSL’) was several times greater than that at the liquid–air interfaces (ΓLV). Adhesion work decreased sharply and then reached a minimum at the critical micelle concentration (CMC), but then increased until reaching a constant. Moreover, a high adhesion force did not indicate better wettability, as it does with rose petals and peanut leaves. For tea leaf surfaces, an increase in the contact angle brought about an increase in the adhesion force. In addition, the maximum retention for Morwet EFW is at different concentrations compared to N-200, N-300, Tween-80, DTAB, and SDS, where the maximum retention of Morwet EFW on tea leaves was 6.05 mg/cm2 at 0.005%.According to the mechanisms of wetting behavior on plant surfaces, a recipe for pesticide formulation can be adjusted with better wettability to reduce loss, improve utilization efficiency, and alleviate adverse effects on the environment.