External Stimuli-Induced Welding of Dynamic Cross-Linked Polymer Networks

Author:

Liu Yun1,Wang Sheng2,Dong Jidong2ORCID,Huo Pengfei2,Zhang Dawei2ORCID,Han Shuaiyuan2ORCID,Yang Jie3ORCID,Jiang Zaixing1

Affiliation:

1. School of Chemistry and Chemical Engineering, Harbin Institute of Technology, Harbin 150040, China

2. Key Laboratory of Bio-Based Materials Science & Technology of Ministry of Education, Northeast Forestry University, Harbin 150040, China

3. Jiangsu Co-Innovation Center of Efficient Processing and Utilization of Forest Resources, College of Science, Nanjing Forestry University, Nanjing 210037, China

Abstract

Thermosets have been crucial in modern engineering for decades, finding applications in various industries. Welding cross-linked components are essential in the processing of thermosets for repairing damaged areas or fabricating complex structures. However, the inherent insolubility and infusibility of thermoset materials, attributed to their three-dimensional network structure, pose challenges to welding development. Incorporating dynamic chemical bonds into highly cross-linked networks bridges the gap between thermosets and thermoplastics presenting a promising avenue for innovative welding techniques. External stimuli, including thermal, light, solvent, pH, electric, and magnetic fields, induce dynamic bonds’ breakage and reformation, rendering the cross-linked network malleable. This plasticity facilitates the seamless linkage of two parts to an integral whole, attracting significant attention for potential applications in soft actuators, smart devices, solid batteries, and more. This review provides a comprehensive overview of dynamic bonds employed in welding dynamic cross-linked networks (DCNs). It extensively discusses the classification and fabrication of common epoxy DCNs and acrylate DCNs. Notably, recent advancements in welding processes based on DCNs under external stimuli are detailed, focusing on the welding dynamics among covalent adaptable networks (CANs).

Publisher

MDPI AG

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