Evaluating Post-Treatment Effects on Electrospun Nanofiber as a Support for Polyamide Thin-Film Formation

Author:

Augusty Anniza Cornelia1,Rangkupan Ratthapol2,Klaysom Chalida1ORCID

Affiliation:

1. Center of Excellence in Particle and Material Processing Technology, Department of Chemical Engineering, Chulalongkorn University, Bangkok 10330, Thailand

2. Metallurgy and Materials Science Research Institute, Chulalongkorn University, Bangkok 10330, Thailand

Abstract

Poly(acrylonitrile-co-methyl acrylate) (PAN-co-MA) electrospun nanofiber (ENF) was used as the support for the formation of polyamide (PA) thin films. The ENF support layer was post-treated with heat-pressed treatment followed by NaOH hydrolysis to modify its support characteristics. The influence of heat-pressed conditions and NaOH hydrolysis on the support morphology and porosity, thin-film formation, surface chemistry, and membrane performances were investigated. This study revealed that applying heat-pressing followed by hydrolysis significantly enhances the physicochemical properties of the support material and aids in forming a uniform polyamide (PA) thin selective layer. Heat-pressing effectively densifies the support surface and reduces pore size, which is crucial for the even formation of the PA-selective layer. Additionally, the hydrolysis of the support increases its hydrophilicity and decreases pore size, leading to higher sodium chloride (NaCl) rejection rates and improved water permeance. When compared with membranes that underwent only heat-pressing, those treated with both heat-pressing and hydrolysis exhibited superior separation performance, with NaCl rejection rates rising from 83% to 98% while maintaining water permeance. Moreover, water permeance was further increased by 29% through n-hexane-rinsing post-interfacial polymerization. Thus, this simple yet effective combination of heat-pressing and hydrolysis presents a promising approach for developing high-performance thin-film nanocomposite (TFNC) membranes.

Funder

Second Century Fund (C2F), Chulalongkorn University

Publisher

MDPI AG

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