Effects of Crystal Orientation and External Stress on the Static Recrystallization Behavior of an Ni-Based Single-Crystal Superalloy

Abstract

The deformation mechanism and static recrystallization (SRX) behavior of an Ni-based single-crystal superalloy are investigated. Indentation tests were performed to investigate the effects of crystal orientation and external stress on SRX behavior. Following solution heat treatment, the depth of the SRX layer below the indentation increases with a deviation angle (β) from the [001] orientation. The slip analysis indicates that an increased deviation angle leads to an increase in the resolved shear stress on the slip plane and a decrease in the number of active slip systems. In addition, the variation pattern of the SRX layer depth with the deviation angle is consistent for different external stresses. The depth of the SRX layer also increases with external stress. The coarse γ′ phases and residual γ/γ′ eutectics obviously enhance the pinning effects on the expansion of recrystallized grain boundaries, resulting in slower growth rates of the recrystallized grains in interdendritic regions than those in dendrite core regions.