Nonlinear Effects of Pulsed Ion Beam in Ultra-High Resolution Material Removal

Abstract

Ion beam sputtering is widely utilized in the area of ultra-high precision fabrication, coating, and discovering the microworld. A pulsed ion beam (PIB) can achieve higher material removal resolution while maintaining traditional ion beam removal performance and macro removal efficiency. In this paper, a 0.01 s pulse width beam is used to sputter atom layer deposition (ALD) coated samples. The nano-scale phenomenon is observed by high-resolution TEM. The results show that when the cumulative sputtering time is less than 1.7 s, the sputtering removal of solid by ion beam is accompanied by a nonlinear effect. Furthermore, the shortest time (0.05 s) and lowest thickness (0.35 nm) necessary to remove a uniform layer of material were established. The definition of its nonlinear effect under a very small removal amount guides industrial ultra-high precision machining. It reveals that PIB not only has high removal resolution on nanoscale, but can also realize high volume removal efficiency and large processing diameter at the same time. These features make PIB promising in the manufacturing of high power/energy laser optics, lithography objective lens, MEMS, and other ultra-high precision elements.