Organomorphic Silicon Carbide Reinforcing Preform Formation Mechanism

Author:

Bogachev Evgeny1ORCID

Affiliation:

1. JSC Kompozit, 4 Pionerskaya, Korolev, 141070 Moscow, Russia

Abstract

Development of the organomorphic ceramic-matrix composites (CMCs), where the reinforcing preform is built using polymer fibers subject essentially to hot pressing, was motivated by a desire to obtain much higher structural uniformity as well as to reduce the number of the process steps involved in the production of CMCs. This paper addresses the peculiarities of the organomorphic silicon carbide preform formation process. Using X-ray phase analysis, tomography, mass and IR spectroscopy, and thermomechanical and X-ray microanalysis, both the properties of the initial fibers of polycarbosilane (PCS)—the silicon carbide fiber precursor—and their transformation in the preform while heated to 1250 °C under constant pressing at 10–100 kPa were studied. Analysis of the data obtained showed the organomorphic SiC preform relative density at a level of 0.3–0.4 to be ensured by self-bonding of the silicon carbide preform, resulting from the fact that during the low-temperature part of pyrolysis, easily polymerizing substances are released leaving a high coke residue, thus cementing the preform. Another possible factor of SiC framework self-bonding is the destruction of the polymer fibers during pyrolysis of various PCS preforms differing in their methylsilane composition (for example, dimethylsilane), where deposition of silicon carbide on the contacting fibers starts as early as at 450–500 °C.

Publisher

MDPI AG

Subject

Engineering (miscellaneous),Ceramics and Composites

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3