An Improvement Method for Improving the Surface Defect Detection of Industrial Products Based on Contour Matching Algorithms

Author:

Wu Haorong1,Luo Ziqi1ORCID,Sun Fuchun2,Li Xiaoxiao3,Zhao Yongxin1

Affiliation:

1. School of Electronic Information and Electrical Engineering, Chengdu University, Chengdu 610106, China

2. School of Mechanical Engineering, Chengdu University, Chengdu 610106, China

3. Key Laboratory of Pattern Recognition and Intelligent Information Processing, Institutions of Higher Education of Sichuan Province, Chengdu University, Chengdu 610106, China

Abstract

Aiming at the problems of the poor robustness and universality of traditional contour matching algorithms in engineering applications, a method for improving the surface defect detection of industrial products based on contour matching algorithms is detailed in this paper. Based on the image pyramid optimization method, a three-level matching method is designed, which can quickly obtain the candidate pose of the target contour at the top of the image pyramid, combining the integral graph and the integration graph acceleration strategy based on weak classification. It can quickly obtain the rough positioning and rough angle of the target contour, which greatly improves the performance of the algorithm. In addition, to solve the problem that a large number of duplicate candidate points will be generated when the target candidate points are expanded, a method to obtain the optimal candidate points in the neighborhood of the target candidate points is designed, which can guarantee the matching accuracy and greatly reduce the calculation amount. In order to verify the effectiveness of the algorithm, functional test experiments were designed for template building function and contour matching function, including uniform illumination condition, nonlinear condition and contour matching detection under different conditions. The results show that: (1) Under uniform illumination conditions, the detection accuracy can be maintained at about 93%. (2) Under nonlinear illumination conditions, the detection accuracy can be maintained at about 91.84%. (3) When there is an external interference source, there will be a false detection or no detection, and the overall defect detection rate remains above 94%. It is verified that the proposed method can meet the application requirements of common defect detection, and has good robustness and meets the expected functional requirements of the algorithm, providing a strong technical guarantee and data support for the design of embedded image sensors in the later stage.

Funder

Sichuan Provincial Key Laboratory of Pattern Recognition and Intelligent Information Processing

Chengdu University Student Innovation Training

Publisher

MDPI AG

Reference22 articles.

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